Read Out Integrated Circuit for Imaging Sensors (Low Light CMOS, IR Sensors etc.)

Si semiconductor design of the ROIC with the following specs:

• Material: Si
• Format: 1280 x 1024
• Pixel Size: 4/ 10um
• Pitch: 4/ 10um
• ADC: 13 /14 bits
• Modes of operation: IWR, ITR
• Integration time: 1 to 10 ms Variable
• Frame Rate: 200 Hz
• Flip Chip Bond: Indium Bumped

Future Expectation from the prototype / Technology developed

ROIC shall be flip chip bonded with a Thermal Detector or Low Light CMOS Sensor of the same format to make an FPA (Focal Plane Array) which is the sensor for imaging solutions.